The Resource Advanced Thermal Management Materials
- Advanced Thermal Management Materials
- Statement of responsibility
- by Guosheng Jiang, Liyong Diao, Ken Kuang
- Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also:Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materialsAdvanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems.
- Image bit depth
- Literary form
- non fiction
ContextContext of Advanced Thermal Management Materials
Embed this data in a secure (HTTPS) page:
Include data citation:
Cite Data - Experimental
Data Citation of the Work Advanced Thermal Management Materials
Copy and paste the following RDF/HTML data fragment to cite this resource
<div class="citation" vocab="http://schema.org/"><i class="fa fa-external-link-square fa-fw"></i> Data from <span resource="http://link.lib.rpi.edu/resource/nZt4FGnkIlY/" typeof="CreativeWork http://bibfra.me/vocab/lite/Work"><span property="name http://bibfra.me/vocab/lite/label"><a href="http://link.lib.rpi.edu/resource/nZt4FGnkIlY/">Advanced Thermal Management Materials</a></span> - <span property="offers" typeOf="Offer"><span property="offeredBy" typeof="Library ll:Library" resource="http://link.lib.rpi.edu/"><span property="name http://bibfra.me/vocab/lite/label"><a property="url" href="http://link.lib.rpi.edu/">Rensselaer Libraries</a></span></span></span></span></div>
Structured data from the Bibframe namespace is licensed under the Creative Commons Attribution 4.0 International License by Rensselaer Libraries. Additional terms may apply to data associated with third party namespaces.
Processing Feedback ...