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The Resource Reliability prediction from burn-in data fit to reliability models, Joseph B. Bernstein

Reliability prediction from burn-in data fit to reliability models, Joseph B. Bernstein

Label
Reliability prediction from burn-in data fit to reliability models
Title
Reliability prediction from burn-in data fit to reliability models
Statement of responsibility
Joseph B. Bernstein
Creator
Author
Subject
Language
eng
Summary
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions
Cataloging source
E7B
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Reliability prediction from burn-in data fit to reliability models, Joseph B. Bernstein
Label
Reliability prediction from burn-in data fit to reliability models, Joseph B. Bernstein
Link
http://libproxy.rpi.edu/login?url=http://www.sciencedirect.com/science/book/9780128007471
Publication
Copyright
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Front Cover; Reliability Prediction from Burn-In Data Fit to Reliability Models; Copyright Page; Contents; Introduction; 1 Shortcut to Accurate Reliability Prediction; 1.1 Background of FIT; 1.2 Multiple Failure Mechanism Model; 1.3 Acceleration Factor; 1.4 New Proportionality Method; 1.5 Chip Designer; 1.6 System Designer; 2 M-HTOL Principles; 2.1 Constant Rate Assumption; 2.2 Reliability Criteria; 2.3 The Failure Rate Curve for Electronic Systems; 2.4 Reliability Testing; 2.5 Accelerated Testing; 3 Failure Mechanisms; 3.1 Time-Dependent Dielectric Breakdown
  • 3.1.1 Early Models for Dielectric Breakdown3.1.2 Acceleration Factors; 3.1.3 Models for Ultrathin Dielectric Breakdown; 3.1.4 Statistical Model; 3.2 Hot Carrier Injection; 3.2.1 Hot Carrier Effects; 3.2.2 Acceleration Factor; 3.2.3 Statistical Models for HCI Lifetime; 3.2.4 Lifetime Sensitivity; 3.3 Negative Bias Temperature Instability; 3.3.1 Degradation Models; 3.3.2 Lifetime Models; 3.4 Electromigration; 3.4.1 Lifetime Prediction; 3.4.2 Lifetime Distribution Model; 3.4.3 Lifetime Sensitivity; 3.5 Soft Errors Due to Memory Alpha Particles; 4 New M-HTOL Approach
  • 4.1 Problematic Zero Failure Criteria4.2 Single Versus Multiple Competing Mechanisms; 4.3 AF Calculation; 4.3.1 TDDB, EM, and HCI Failure Rate Calculations under Single Failure Mechanism Assumption; 4.3.2 TDDB, EM, and HCI Failure Rate Calculations under Multiple Failure Mechanism Assumption; 4.4 Electronic System CFR Approximation/Justification; 4.4.1 Exponential Distribution; 4.4.2 The Reliability of Complex Systems; 4.4.3 Drenick's Theorem; 4.5 PoF-Based Circuits Reliability Prediction Methodology; 4.5.1 Methodology; 4.5.2 Assumptions; 4.5.3 Input Data; 4.5.4 Device Thermal Analysis
  • 4.6 Cell Reliability Estimation4.6.1 ESF Evaluation; 4.6.2 Cell Reliability; 4.7 Chip Reliability Prediction; 4.7.1 Functional Block Reliability; 4.7.2 Power Network EM Estimation; 4.8 Matrix Method; Bibliography
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9781306490382&userID=ebsco-test&password=ebsco-test
Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b4171060'}
Extent
1 online resource (108 pages)
Form of item
online
Isbn
9781306490382
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations
Specific material designation
remote

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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