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The Resource Quality conformance and qualification of microelectronic packages and interconnects, edited by Michael Pecht ... (et al.)

Quality conformance and qualification of microelectronic packages and interconnects, edited by Michael Pecht ... (et al.)

Label
Quality conformance and qualification of microelectronic packages and interconnects
Title
Quality conformance and qualification of microelectronic packages and interconnects
Statement of responsibility
edited by Michael Pecht ... (et al.)
Contributor
Subject
Quality conformance and qualification of microelectronic packages and interconnects, edited by Michael Pecht ... (et al.)
Label
Quality conformance and qualification of microelectronic packages and interconnects, edited by Michael Pecht ... (et al.)
Publication
Note
'A Wiley-Interscience publication.'
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Bibliography note
Includes bibliographical references (p. 419-450) and index
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Dimensions
25 cm.
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{'f': 'http://opac.lib.rpi.edu/record=b1258042'}
Extent
xxxiii, 461 p.
Isbn
9780471594369
Isbn Type
(alk. paper) :
Lccn
93-9709
Other physical details
ill.

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