Coverart for item
The Resource Proceedings, 1998 IEEE Symposium on IC/Package Design Integration : February 2-3, 1998, Santa Cruz, California, sponsored by IEEE Computer Society ... [et al.]

Proceedings, 1998 IEEE Symposium on IC/Package Design Integration : February 2-3, 1998, Santa Cruz, California, sponsored by IEEE Computer Society ... [et al.]

Label
Proceedings, 1998 IEEE Symposium on IC/Package Design Integration : February 2-3, 1998, Santa Cruz, California
Title
Proceedings, 1998 IEEE Symposium on IC/Package Design Integration
Title remainder
February 2-3, 1998, Santa Cruz, California
Statement of responsibility
sponsored by IEEE Computer Society ... [et al.]
Title variation
  • IEEE Symposium on IC/Package Design Integration
  • IC/Package Design Integration
  • IPDI '98
Creator
Contributor
Subject
Genre
Language
eng
Cataloging source
NAT
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
bibliography
Proceedings, 1998 IEEE Symposium on IC/Package Design Integration : February 2-3, 1998, Santa Cruz, California, sponsored by IEEE Computer Society ... [et al.]
Label
Proceedings, 1998 IEEE Symposium on IC/Package Design Integration : February 2-3, 1998, Santa Cruz, California, sponsored by IEEE Computer Society ... [et al.]
Publication
Note
  • "This is the inaugural year for the IEEE Symposium on IC/Package Design Integration (IPDI '98). The symposium marks a new direction for the previous IEEE Multichip Module Conference"--P. viii
  • "98CB36211"--Spine
  • "PR8433"--Label on t.p. verso
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Bibliography note
Includes bibliographical references and author index
Contents
Logic and Memory -- Interconnections -- High-Level Design Methodologies -- Flip-Chip -- RF-Wireless -- Package Design -- Modeling and Analysis
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780818684333&userID=ebsco-test&password=ebsco-test
Dimensions
29 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1345568'}
Extent
x, 149 p.
Isbn
9780818684333
Isbn Type
(Softbound)
Lccn
98079698
Other physical details
ill.

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