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The Resource Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition

Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition

Label
Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition
Title
Practical Guide to the Packaging of Electronics
Title remainder
Thermal and Mechanical Design and Analysis, Third Edition
Creator
Subject
Language
eng
Cataloging source
MiAaPQ
Literary form
non fiction
Nature of contents
dictionaries
Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition
Label
Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition
Link
http://libproxy.rpi.edu/login?url=https://ebookcentral.proquest.com/lib/rpi/detail.action?docID=4755939
Publication
Copyright
Related Contributor
Related Location
Related Agents
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Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Cover -- Half Title -- Title -- Copyright -- Dedication -- Contents -- List of Figures -- List of Tables -- Preface to the Third Edition -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Author -- 1: Introduction -- Issues in Electronics Packaging Design -- Technical Management Issues -- Electronics Design -- Packaging/Enclosure Design -- Reliability -- 2: Basic Heat Transfer-Conduction, Convection, and Radiation -- Basic Equations and Concepts -- General Equations -- Nondimensional Groups -- Nusselt Number -- Grashof Number -- Prandtl Number -- Reynolds Number -- 3: Conductive Cooling -- Introduction -- Thermal Resistance -- Sample Problem and Calculations -- Resistance Network -- Network Rules -- Sample Problem and Calculations -- Comparison with Exact Results -- Assumptions -- Temperature at Intermediate Points -- Exercise: IC Temperature Determination -- Heat Spreading -- Thermal Modeling -- Applications -- Junction-to-Case Resistance -- Contact Interface Resistance -- Modeling the Interface -- Exercise-Calculate the Component Temperature -- First Approach -- Second Approach -- Third Approach -- A Word on Edge Guides -- 2D or 3D Heat Conduction -- Thermal Conductance -- 4: Radiation Cooling -- Introduction -- Factors Influencing Radiation -- Surface Properties -- View Factor Calculations -- View Factor Calculations in Electronics Packages -- Examples and Illustrations -- Electronics Packaging Problem -- Flow in a Vertical Open-Ended Channel -- Cabinet Surface Temperature -- First Approach -- Second Approach -- A Few Design Tips -- 5: Fundamentals of Convection Cooling -- Introduction -- Flow Regimes, Types, and Influences -- Free (or Natural) Convection -- Estimates of Heat Transfer Coefficient -- Solution Procedure -- High Altitudes -- Board Spacing and Inlet-Outlet Openings -- Design Tips
  • Cabinet Interior and Surface Temperature -- Calculating Surface Temperature -- Calculation of Internal Temperature -- Calculation of Component Temperature -- Fin Design -- Basic Procedure -- RF Cabinet Free Convection Cooling -- Analytical Approach -- Design Recommendations for This Example -- A More Exact Procedure -- Forced Convection -- Direct Flow System Design -- Required Flow Rate -- Board Spacing and Configurations -- Flow Resistance -- Flow Networks -- Flow Rate Distribution between Parallel Plates -- Optimum Board Spacing and Heat Flow -- System's Impedance Curve -- Sample Problem -- Fan Selection and Fan Laws -- Fan Performance Curve -- Fan Networks -- More on Fan Performance Curves -- Fan Laws -- Component Hot Spot -- Calculating hc Using Colburn Factor -- Calculating hc Using Flow Rate -- Indirect Flow System Design -- Resistance Network Representation -- 6: Combined Modes, Transient Heat Transfer, and Advanced Materials -- Introduction -- Total System Resistance -- Time-Dependent Temperature Variation -- Temperature Rise of an Electronics Module -- Advanced Materials and Technologies -- Solid-State Air/Liquid Pump Cooling -- Graphite Foam -- Metal Matrix and Composite Materials -- Graphene and Other Interface Materials -- 7: Basics of Vibration and Its Isolation -- Introduction -- Periodic and Harmonic Motions -- Free Vibration -- First Application -- Second Application -- Mode Shapes -- Damped Vibration -- Impact of Damping -- Forced Vibration -- Engineering Applications -- Dynamic Magnification Factor -- Transmissibility -- Phase Angle -- Vibration through Base Excitation -- Vibration Isolation -- Applications to Electronics Enclosures -- Maximum Deflection -- Typical Transmissibility Values in Electronics Enclosures -- Maximum Desired PCBA Deflection -- Random Vibration -- Vibration Terminology -- Peak Value -- Average Value
  • Mean Square Value -- Root Mean Square -- Decibel -- Octave -- Spectral Density -- Solution Techniques for Random Vibration -- Excitation Spectrum -- Equipment Response -- Vibrations and Mechanical Stresses Caused by Acoustics and Noise -- Multiple DOF Systems -- A Few Words on Advanced and Active Isolation Techniques -- 8: Basics of Shock Management -- Introduction -- Pulse Shock Isolation -- System without Isolators -- System with Isolators -- Design 1 -- Design 2 -- Design 3 -- Design 4 -- Velocity Shock Isolation -- Maximum Desired PCBA Deflection -- Equipment Design -- 9: Induced Stresses -- Introduction -- Forced Vibration -- Sample Problem -- Random Vibration -- Probability of Failure -- Shock Environment -- 10: The Finite Element Methods -- Introduction -- Some Basic Definitions -- The FEA Procedure -- Finite Element Formulation -- Formulation of Characteristic Matrix and Load Vector -- Direct Approach -- Variational (Energy) Approach -- Weighted Residual Approach -- Finite Element Formulation of Dynamic Problems -- Wave Propagation Type -- Vibration Type -- Methods of Solving This Equation -- Impact of Boundary Conditions -- Uniform Bar -- Finite Element Formulation of Heat Conduction -- CAD to FEA Considerations -- CAD to FEA, Do's and Do Not's -- Criteria for Choosing Engineering Software -- What Types of Engineering Programs Are There? -- CAD and CAM -- Solid Mechanics and Stress Analysis FEA Software -- Fluid Mechanics and Heat Transfer CFD Software -- General Physics CFD and/or FEA -- Which Software Should I Choose? -- Application -- Complete Package -- User Interface, Manuals, and Training -- Customer Support -- Quality Assurance -- Maintenance -- Error Reports and Bug Fixes -- Software Performance Testing -- Validation -- Interfacing to Other Programs -- Summary -- 11: Mechanical and Thermomechanical Concerns -- Introduction
  • General Stress-Strain Relationship -- Anisotropic Behavior -- Orthotropic Behavior -- Isotropic Behavior -- Material Behavior and the Stress-Strain Curve -- Determining Deformations under Application of General Loads -- Thermal Strains and Stresses -- Thermal Strains and Deflections -- Basic Equation -- Die Attachments -- Integrated Circuit Devices -- Printed Circuit Board Warpage -- Some Tips for Avoiding Temperature-Related Failures -- Simplifications (or Making Engineering Assumptions) -- Linear Elasticity -- Geometric Simplifications -- Stress Concentration -- 12: Acoustics -- Introduction -- Noise, Sound, and Their Difference -- Basic Definitions -- Governing Equations -- Measurement and Standards -- Acoustics as a Design Priority\ -- Inefficient Fans -- Aeroacoustics -- Resonance -- 13: Mechanical Failures and Reliability -- Introduction -- Failure Modes -- Failures by Elastic Deflection -- Failures by Extensive Yielding -- Failures by Fracture -- Progressive Failures -- Life Expectancy -- Life Expectancy for Pure Fatigue Conditions -- Life Expectancy for Random Vibration Conditions -- Life Expectancy for Pure Creep Conditions -- Life Expectancy for Creep-Fatigue Interactions -- Design Life, Reliability, and Failure Rate -- 14: Electrical Failures and Reliability -- Introduction -- Failure Modes and Mechanism -- Failure Modes -- Open Circuit Failure Mode -- Short Circuit Failure Mode -- Intermittent Failure Mode -- Failure Mechanism -- Life Expectancy of Electronics Assemblies -- The Arrhenius Model -- The Eyring Model -- Black's Equation for Electrical Stress Effects -- Design Life, Reliability, and Failure Rate -- 15: Chemical Attack Failures and Reliability Concerns -- Introduction -- Electrochemical Attacks -- Corrosion -- Galvanic Cells -- Stress Cells -- Fretting Corrosion -- Chemical Attacks on Plastics
  • Corrosion Control through Proper Design Techniques -- Migration and Electromigration -- 16: Reliability Models, Predictions, and Calculations -- Introduction -- Basic Definitions -- Reliability Models -- Exponential Distribution Model -- Lognormal Distribution -- Weibull Distribution -- AT&T's Weibull Distribution -- Selecting the Right Distribution -- The Exponential Distribution -- The Lognormal Distribution -- The Weibull Distribution -- Device Failure Rate Prediction -- Temperature, Electrical, and Environmental Impacts on Failure Rate -- Temperature Effects -- Electrical Stress Effects -- Environmental Factors -- System Failure Rate -- Component Hazard Rate -- System Hazard Rate -- Reliability Testing -- HALT and HASS -- HALT at the Design Stage -- HASS at the Manufacturing Stage -- Reliability Predictions Based on Test Data -- 17: Design Considerations in an Avionics Electronic Package -- Introduction -- Design Parameters -- Operational Characteristics -- Reference Documents -- Electrical Design Specifications -- Mechanical Design Specifications -- Electrical and Thermal Parameters -- Analysis -- Thermal Analysis -- Load Carrying and Vibration Analysis -- Reliability and MTBF Calculations -- First Year Electronics Failures -- Acknowledgment -- Appendix A: Description of Finite Element Model -- Appendix B: Standard Atmosphere -- Appendix C: Transient Flow Emperical Factor -- Appendix D: Impact of Convection on Spread Angle -- Appendix E: Heat Transfer Cofficients Models-Narrow Gap versus Wide Gap -- Appendix F: Creep -- Appendix G: Fatigue -- References -- Index
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{'f': 'http://opac.lib.rpi.edu/record=b4214052'}
Edition
3rd ed.
Extent
1 online resource (375 pages)
Form of item
online
Isbn
9781315351087
Media category
computer
Media MARC source
rdamedia
Media type code
c
Sound
unknown sound
Specific material designation
remote

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