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The Resource Newnes Electronics Assembly Handbook, Keith Brindley, (electronic resource)

Newnes Electronics Assembly Handbook, Keith Brindley, (electronic resource)

Label
Newnes Electronics Assembly Handbook
Title
Newnes Electronics Assembly Handbook
Statement of responsibility
Keith Brindley
Creator
Subject
Language
eng
Summary
Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are
Cataloging source
AU-PeEL
Nature of contents
dictionaries
Newnes Electronics Assembly Handbook, Keith Brindley, (electronic resource)
Label
Newnes Electronics Assembly Handbook, Keith Brindley, (electronic resource)
Link
http://libproxy.rpi.edu/login?url=https://ebookcentral.proquest.com/lib/rpi/detail.action?docID=1837933
Publication
Note
Description based upon print version of record
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Contents
  • Front Cover; Newnes Electronics Assembly Handbook; Copyright Page; Table of Contents; Preface; Chapter 1. Introduction; Bringing together varied disciplines; Applications; Standardization; Book layout and description; Chapter 2. Electronics assembly: the PCB; The printed circuit board; Base materials; Basic mechanical properties; PCB manufacture; PCB manufacturing processes; Design; Layout; Through-hole PCB assembly; Testing; Cleaning of assemblies; Conformal coatings; Total automatic assembly; Chapter 3. Electronics assembly: the SMA; Surface mounted assemblies; Advantages and disadvantages
  • Surface mounted componentsBase materials; Thermal design of surface mounted assemblies; Design; Assembly; Assembly variations; Testing assemblies; Component placement; References; Chapter 4. Electromechanical assembly: packaging; Packaging engineering; Adhesives; Thermal management; Environmental considerations; Electromagnetic compatability; References; Chapter 5. Soldering; Changing face; Requirements of the soldering process; Solderability and protective coatings; Soldering processes; Solder; Flux; Types of joints; Solder resists; Hand soldering; Mass CS soldering - wave soldering
  • Mass SC reflow solderingComparison of soldering processes; Cleaning of PCBs; References; Chapter 6. Testing for quality; The philosophy of quality; Reliability; Component parts testing; Production processes; The unpackaged assembly; The packaged assembly; References; Chapter 7. Standardization of electronics manufacture: quality assurance; Standards; Reference to standards; Levels of standards; Standards organizations and bodies; The work of BSI; BSS; Assessed capability of companies; Assessed quality of components; Setting up company standards; References
  • Chapter 8. Selling to the Ministry of DefenceMoD organization; Procurement executive; Procurement executive policy and procedures; Quality assurance; Glossary; Appendix 1: Worldwide standards; Guide to relevant worldwide standards, by subject; Guide to relevant worldwide standards, by reference; Appendix 2: Worldwide addresses; UK Governmental Departments; Institutions and associations; Standards organizations and bodies; Appendix 3: Further reading; Index
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Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b3738809'}
Extent
1 online resource (354 p.)
Form of item
electronic
Isbn
9781483102511
Specific material designation
remote

Library Locations

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      42.729766 -73.682577
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