Coverart for item
The Resource Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging, Xing-Chang Wei

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging, Xing-Chang Wei

Label
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
Title
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
Statement of responsibility
Xing-Chang Wei
Creator
Author
Subject
Language
eng
Cataloging source
MiAaPQ
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging, Xing-Chang Wei
Label
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging, Xing-Chang Wei
Link
https://ebookcentral.proquest.com/lib/connectny/detail.action?docID=5050058
Publication
Copyright
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Bibliography note
Includes bibliographical references at the end of each chapters and index
Carrier category
online resource
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type MARC source
rdacontent
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9781315305868&userID=ebsco-test&password=ebsco-test
Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b4379588'}
Extent
1 online resource (341 pages)
Form of item
online
Isbn
9781315305868
Isbn Type
(e-book)
Media category
computer
Media MARC source
rdamedia
Other physical details
illustrations
Sound
unknown sound
Specific material designation
remote

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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