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The Resource Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films

Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films

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Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films
Title
Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films
Creator
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Dissertation note
Thesis (master's)--Rensselaer Polytechnic Institute, August, 1993.
Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films
Label
Microstructure and stress evaluation of high dielectric constant ceramic/copper multilayer thin films
Publication
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http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1242885'}
Extent
xiv, 143 p.
Other physical details
ill.

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