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The Resource Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989, edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International

Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989, edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International

Label
Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
Title
Microelectronic packaging technology
Title remainder
materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
Statement of responsibility
edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
Title variation
Micro electronic packaging technology
Creator
Contributor
Subject
Genre
Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989, edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
Label
Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989, edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
Publication
Note
  • Cover title: Micro electronic packaging technology
  • 'SAN 204-7586'--T.p. verso
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Bibliography note
Includes bibliographies
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780871703590&userID=ebsco-test&password=ebsco-test
Dimensions
29 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1190513'}
Extent
xii, 479 p.
Isbn
9780871703590
Lccn
89-80612
Other physical details
ill.

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