Coverart for item
The Resource Microelectronic packaging and laser processing : 25-26 June, 1997, Singapore, Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter ... [et al.] ; cooperating organizations Nanyang Technological University (Singapore) ... [et al.] ; published by SPIE--the International Society for Optical Engineering

Microelectronic packaging and laser processing : 25-26 June, 1997, Singapore, Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter ... [et al.] ; cooperating organizations Nanyang Technological University (Singapore) ... [et al.] ; published by SPIE--the International Society for Optical Engineering

Label
Microelectronic packaging and laser processing : 25-26 June, 1997, Singapore
Title
Microelectronic packaging and laser processing
Title remainder
25-26 June, 1997, Singapore
Statement of responsibility
Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter ... [et al.] ; cooperating organizations Nanyang Technological University (Singapore) ... [et al.] ; published by SPIE--the International Society for Optical Engineering
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
LHL
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
bibliography
Series statement
Proceedings of SPIE--the International Society for Optical Engineering
Series volume
v. 3184
Microelectronic packaging and laser processing : 25-26 June, 1997, Singapore, Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter ... [et al.] ; cooperating organizations Nanyang Technological University (Singapore) ... [et al.] ; published by SPIE--the International Society for Optical Engineering
Label
Microelectronic packaging and laser processing : 25-26 June, 1997, Singapore, Yong Khim Swee, Hong Yu Zheng, Ray T. Chen, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering, SPIE Singapore Chapter, Institute of Physics, Singapore ; cosponsored by SPIE Japan Chapter ... [et al.] ; cooperating organizations Nanyang Technological University (Singapore) ... [et al.] ; published by SPIE--the International Society for Optical Engineering
Publication
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Bibliography note
Includes bibliographical references and author index
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780819426116&userID=ebsco-test&password=ebsco-test
Dimensions
28 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1340918'}
Extent
vii, 230 p.
Isbn
9780819426116
Other physical details
ill.

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