Coverart for item
The Resource Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability, Michael Pecht

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability, Michael Pecht

Label
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
Title
Integrated circuit, hybrid, and multichip module package design guidelines
Title remainder
a focus on reliability
Statement of responsibility
Michael Pecht
Creator
Subject
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability, Michael Pecht
Label
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability, Michael Pecht
Publication
Note
'A Wiley-Interscience publication.'
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Bibliography note
Includes bibliographical references
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780471594468&userID=ebsco-test&password=ebsco-test
Dimensions
24 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1249334'}
Extent
xxxi, 426 p.
Isbn
9780471594468
Isbn Type
(cloth : alk. paper)
Lccn
93-12475
Other physical details
ill.

Library Locations

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      42.729766 -73.682577
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