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The Resource Hybrid assemblies and multichip modules, Fred W. Kear

Hybrid assemblies and multichip modules, Fred W. Kear

Label
Hybrid assemblies and multichip modules
Title
Hybrid assemblies and multichip modules
Statement of responsibility
Fred W. Kear
Creator
Subject
Member of
Series statement
Manufacturing engineering and materials processing
Series volume
38
Hybrid assemblies and multichip modules, Fred W. Kear
Label
Hybrid assemblies and multichip modules, Fred W. Kear
Publication
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Bibliography note
Includes bibliographical references (p. 265-267) and index
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Dimensions
24 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1236347'}
Extent
x, 278 p.
Isbn
9780824784669
Isbn Type
(alk. paper)
Lccn
92-33369
Other physical details
ill.

Library Locations

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