Coverart for item
The Resource Flip chip technologies, John H. Lau, editor

Flip chip technologies, John H. Lau, editor

Label
Flip chip technologies
Title
Flip chip technologies
Statement of responsibility
John H. Lau, editor
Contributor
Subject
Language
eng
Member of
Cataloging source
DLC
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.F5897 1996
Literary form
non fiction
Nature of contents
bibliography
Flip chip technologies, John H. Lau, editor
Label
Flip chip technologies, John H. Lau, editor
Publication
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Related Items
Bibliography note
Includes bibliographical references and index
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780070366091&userID=ebsco-test&password=ebsco-test
Dimensions
24 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1320704'}
Extent
xxiv, 565 p.
Isbn
9780070366091
Isbn Type
(hc)
Lccn
95044649
Other physical details
ill.

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
Processing Feedback ...