Coverart for item
The Resource Flex-circuit packaging for power electronics
Label
Flex-circuit packaging for power electronics
Title
Flex-circuit packaging for power electronics
Creator
Contributor
Dissertation note
Thesis (master's)--Rensselaer Polytechnic Institute, Aug. 2001.
Flex-circuit packaging for power electronics
Label
Flex-circuit packaging for power electronics
Publication
Related Contributor
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1398730'}
Extent
xi, 93 p.
Other physical details
ill.

Library Locations

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      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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