Coverart for item
The Resource Engineering materials for biomedical applications, Teoh Swee Hin

Engineering materials for biomedical applications, Teoh Swee Hin

Label
Engineering materials for biomedical applications
Title
Engineering materials for biomedical applications
Statement of responsibility
Teoh Swee Hin
Creator
Subject
Language
eng
Member of
Cataloging source
SISPL
Illustrations
illustrations
Index
index present
Literary form
non fiction
Series statement
Biomaterials engineering and processing series
Series volume
v. 1
Engineering materials for biomedical applications, Teoh Swee Hin
Label
Engineering materials for biomedical applications, Teoh Swee Hin
Publication
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Related Items
Bibliography note
Includes bibliographical references and index
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9789812560612&userID=ebsco-test&password=ebsco-test
Dimensions
24 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1751343'}
Extent
1 v. (various pagings)
Isbn
9789812560612
Isbn Type
(cased)
Other physical details
ill. (some col.)

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
Processing Feedback ...