Coverart for item
The Resource Design and modeling for 3D ICs and interposers, Madhavan Swaminathan, Ki Jin Han
Label
Design and modeling for 3D ICs and interposers
Title
Design and modeling for 3D ICs and interposers
Statement of responsibility
Madhavan Swaminathan, Ki Jin Han
Creator
Contributor
Subject
Language
eng
Member of
Cataloging source
MiAaPQ
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Series statement
WSPC series in advanced integration and packaging
Series volume
volume 2
Design and modeling for 3D ICs and interposers, Madhavan Swaminathan, Ki Jin Han
Label
Design and modeling for 3D ICs and interposers, Madhavan Swaminathan, Ki Jin Han
Link
http://libproxy.rpi.edu/login?url=https://ebookcentral.proquest.com/lib/connectny/detail.action?docID=1578321
Publication
Copyright
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Related Items
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type MARC source
rdacontent
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9789814508605&userID=ebsco-test&password=ebsco-test
Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b4297345'}
Extent
1 online resource (379 pages)
Form of item
online
Isbn
9789814508605
Isbn Type
(e-book)
Media category
computer
Media MARC source
rdamedia
Other physical details
illustrations
Sound
unknown sound
Specific material designation
remote

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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