Coverart for item
The Resource Advances in resist technology and processing XX : 24-26 February, 2003, Santa Clara, California, USA, Theodore H. Fedynyshyn, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, International SEMITECH, Semiconductor Equipment and Materials International

Advances in resist technology and processing XX : 24-26 February, 2003, Santa Clara, California, USA, Theodore H. Fedynyshyn, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, International SEMITECH, Semiconductor Equipment and Materials International

Label
Advances in resist technology and processing XX : 24-26 February, 2003, Santa Clara, California, USA
Title
Advances in resist technology and processing XX
Title remainder
24-26 February, 2003, Santa Clara, California, USA
Statement of responsibility
Theodore H. Fedynyshyn, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, International SEMITECH, Semiconductor Equipment and Materials International
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
LHL
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
bibliography
Series statement
SPIE proceedings series
Series volume
v. 5039
Advances in resist technology and processing XX : 24-26 February, 2003, Santa Clara, California, USA, Theodore H. Fedynyshyn, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, International SEMITECH, Semiconductor Equipment and Materials International
Label
Advances in resist technology and processing XX : 24-26 February, 2003, Santa Clara, California, USA, Theodore H. Fedynyshyn, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, International SEMITECH, Semiconductor Equipment and Materials International
Publication
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Bibliography note
Includes bibliographical references and author index
http://library.link/vocab/cover_art
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Dimensions
28 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1517553'}
Extent
2 v.
Isbn
9780819448446
Other physical details
ill.

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