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The Resource Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992, sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'

Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992, sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'

Label
Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992
Title
Advances in electronic packaging, 1992
Title remainder
proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992
Statement of responsibility
sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'
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Contributor
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Genre
Member of
Series statement
EEP
Series volume
vol. 1 (i.e. 2)
Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992, sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'
Label
Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992, sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'
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Contents
v. 1. Physical design thermal management interconnection technology structural analysis -- v. 2. Materials and processes reliability quality control and NDE
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780791807668&userID=ebsco-test&password=ebsco-test
Dimensions
28 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1236241'}
Extent
2 v. (xi, 1015 p.)
Isbn
9780791807668
Lccn
92-53846
Other physical details
ill.

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