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The Resource Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging, guest editors Christopher Bailey and Johan Liu, (electronic resource)

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging, guest editors Christopher Bailey and Johan Liu, (electronic resource)

Label
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Title
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Statement of responsibility
guest editors Christopher Bailey and Johan Liu
Contributor
Subject
Language
eng
Cataloging source
MiAaPQ
Index
no index present
Literary form
non fiction
Nature of contents
dictionaries
Series statement
Soldering & surface mount technology
Series volume
v.18, no. 2
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging, guest editors Christopher Bailey and Johan Liu, (electronic resource)
Label
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging, guest editors Christopher Bailey and Johan Liu, (electronic resource)
Link
http://libproxy.rpi.edu/login?url=https://ebookcentral.proquest.com/lib/connectny/detail.action?docID=267393
Publication
Related Contributor
Related Location
Related Agents
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Color
multicolored
Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b3996601'}
Extent
72 p.
Form of item
  • online
  • electronic
Reproduction note
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Specific material designation
remote

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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