Coverart for item
The Resource Advanced electronic packaging : with emphasis on multichip modules, edited by William D. Brown

Advanced electronic packaging : with emphasis on multichip modules, edited by William D. Brown

Label
Advanced electronic packaging : with emphasis on multichip modules
Title
Advanced electronic packaging
Title remainder
with emphasis on multichip modules
Statement of responsibility
edited by William D. Brown
Contributor
Subject
Language
eng
Member of
Cataloging source
DLC
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.A332 1999
Literary form
non fiction
Nature of contents
bibliography
Series statement
IEEE Press series on microelectronic systems
Advanced electronic packaging : with emphasis on multichip modules, edited by William D. Brown
Label
Advanced electronic packaging : with emphasis on multichip modules, edited by William D. Brown
Publication
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Related Items
Bibliography note
Includes bibliographical references and index
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780780347007&userID=ebsco-test&password=ebsco-test
Dimensions
26 cm.
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b1358053'}
Extent
xxxii, 789 p.
Isbn
9780780347007
Isbn Type
(alk. paper)
Lccn
98033575
Other physical details
ill.

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
Processing Feedback ...