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The Resource Advanced Thermal Management Materials, by Guosheng Jiang, Liyong Diao, Ken Kuang, (electronic resource)

Advanced Thermal Management Materials, by Guosheng Jiang, Liyong Diao, Ken Kuang, (electronic resource)

Label
Advanced Thermal Management Materials
Title
Advanced Thermal Management Materials
Statement of responsibility
by Guosheng Jiang, Liyong Diao, Ken Kuang
Creator
Contributor
Subject
Language
eng
Summary
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also:Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materialsAdvanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems. 
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Literary form
non fiction
Advanced Thermal Management Materials, by Guosheng Jiang, Liyong Diao, Ken Kuang, (electronic resource)
Label
Advanced Thermal Management Materials, by Guosheng Jiang, Liyong Diao, Ken Kuang, (electronic resource)
Link
http://libproxy.rpi.edu/login?url=http://dx.doi.org/10.1007/978-1-4614-1963-1
Publication
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Antecedent source
mixed
Color
not applicable
Contents
Introduction to Thermal Management in Microelectronics Packaging -- Requirements of Thermal Management Materials -- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials -- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies -- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications --  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications -- Al/SiC Thermal Management Materials -- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper -- Future Trend of Advanced Thermal Management Materials
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https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9781461419631&userID=ebsco-test&password=ebsco-test
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unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b3393534'}
Extent
VIII, 156 p. 72 illus., 29 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781461419631
Level of compression
uncompressed
Other physical details
digital.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote

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    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
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