Coverart for item
The Resource Adhesives technology for electronic applications : materials, processes, reliability, by James J. Licari and Dale W. Swanson

Adhesives technology for electronic applications : materials, processes, reliability, by James J. Licari and Dale W. Swanson

Label
Adhesives technology for electronic applications : materials, processes, reliability
Title
Adhesives technology for electronic applications
Title remainder
materials, processes, reliability
Statement of responsibility
by James J. Licari and Dale W. Swanson
Creator
Contributor
Subject
Language
eng
Summary
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references
Member of
Cataloging source
COO
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Series statement
Materials and processes for electronic applications series
Adhesives technology for electronic applications : materials, processes, reliability, by James J. Licari and Dale W. Swanson
Label
Adhesives technology for electronic applications : materials, processes, reliability, by James J. Licari and Dale W. Swanson
Link
http://libproxy.rpi.edu/login?url=http://app.knovel.com/hotlink/toc/id:kpATEAMPRA/adhesives-technology-for
Publication
Related Contributor
Related Location
Related Agents
Related Authorities
Related Subjects
Related Items
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index
http://library.link/vocab/cover_art
https://contentcafe2.btol.com/ContentCafe/Jacket.aspx?Return=1&Type=S&Value=9780815515135&userID=ebsco-test&password=ebsco-test
Dimensions
unknown
http://library.link/vocab/discovery_link
{'f': 'http://opac.lib.rpi.edu/record=b3763498'}
Extent
1 online resource (xvi, 459 pages)
Form of item
online
Isbn
9780815515135
Lccn
2005012647
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations.
Specific material designation
remote

Library Locations

    • Folsom LibraryBorrow it
      110 8th St, Troy, NY, 12180, US
      42.729766 -73.682577
Processing Feedback ...